With zero surprises.
Assemble. Validate. Release
Packaging is more than assembly, it’s your product’s first test in the real world. SilTest provides advanced packaging design support and end-to-end qualification services to ensure your device meets the demands of your market, not just the specs.
WHY IT MATTERS
A chip that passes a functional test still isn’t ready for production. It must survive heat, shock, moisture, and electrical stress, reliably over time.
We help you bridge the gap between engineering samples and a qualified product, whether you are launching a new device, meeting automotive standards, or submitting for customer audits.
What
We Offer.
Wafer
Packaging
Qualification
Release
Packaging Services
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Custom package selection & design (QFN, WB-BGA, FCBGA, SiP, MCM)
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Substrate and interposer layout support
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Ceramic & adaptive packaging R&D
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ISO7 cleanroom assembly in the EU
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MPW & SPW wafer assembly for early samples
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Works best for: prototyping teams, mixed-node portfolios, or custom packaging needs
Qualification Services
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Generation of qual-ready test programs (bench & ATE)
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Sample prep and screening across test stages
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Coordination with EU-based labs for:
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HTOL, ELFR, Temp Cycle, ESD, Latch-up
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Manual probing & Failure Analysis
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Full reporting, traceability, and PPAP support
Seamless handoff from wafer to product-level validation
Strong integration with Test Engineering and Yield Management
Fast engineering sample delivery for customer feedback
Trusted European ecosystem for reliability testing
Already have samples but not enough data? We can build a qualification test program that works across bench or ATE setups.
Package
Comparison.
Package Name
Lite
Full Stack
Total Integration
Coverage
Evaluation Ready
Qual-Ready Flow
Full Production Release
What
You Get
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Basic MPW packaging (1package type)
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Engineering sample assembly
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No simulation or qualification
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Fast delivery (2–3 weeks)
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Best for early evals, pre-qual design validation
Qualification not included
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2–3 package formats
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Documentation for handling, substrate, BOM
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Coordination with reliability test partners
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Bench or ATE-based sample screening
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Intermediate reports (e.g., HTOL data, Temp Cycle results)
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Best for NPI qualification, customer samples, PPAP-prep
Qualification:
✔ Partial (HTOL, ELFR, ESD)
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Everything in the Full Stack Package
+
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Full-stack dashboard across wafer, FT, qual, packaging
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Commonality analysis across fabs/sites/handling
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Bin stability tracking and escape mapping
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Automated scripts, alerting, and reporting
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Embedded support during ramp
Delivery
Packaged engineering samples
Packaged devices,
documentation, qual test reports
Packaged devices, equal execution
reports and PPAP documentation
Compliance
No formal PPAP support
AEC-Q100 analysis support
Full compliance support for AEC-Q100, ISO 26262, and PPAP
Support
Limited to logistics + delivery
Weekly syncs + design review
Dedicated project lead + QA process setup
What Set Us
Apart.
Flexible Sample Sizes
No fixed MOQ — tailored flows for MPW to pilot runs
EU-Based Lab
Avoids import delays and logistics complications
Traceability by Default
From vector source to FA report
Automotive Ready
Designed for ISO 26262, AEC-Q100, and customer qualification audits
Lite
Use Case: Pre-qual packaging & early evaluation
Packaging: MPW samples, 1 package type
Qualification: Sample prep only
Turnaround: Fastest delivery (2–3 weeks)
Full Stack
Use Case: Qualification-ready sample flow
Packaging: 2–3 package formats + documentation
Qualification: Qualification via partners
Turnaround: 3–5 weeks + intermediate reports
Total Integration
Use Case: Full test + qual release + doc support
Packaging: Full stack incl. R&D, substrate + sim
Qualification: Full qual + reliability + PPAP support
Turnaround: Fully scoped project timeline
Choose your plan.
Find one that works for you
Related
Services.
Need test programs for qualification? Visit Test Engineering
Managing wafer yield post-qual? Head to Yield Management
Want to train your team on qualification flows? Check out SilTest Academy